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  • The latest aircrafts are equipped with integrated electronic instruments in sleek fuselages. Increased volume of wiring harnesses for the equipments, crammed into decreased space, is vulnerable to serious crosstalk and heat emissions.
    To solve the problems, I developed new fluoropolymer-based materials, which have drastically reduced the thickness of insulation layers, offering excellent EMI shielding and heat resistance. Meeting US military and other specs, the materials are supplied to aircraft manufacturers worldwide. R 1
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